Impact of the Hollow Microspheres’ Filling Degree on the Electrical dc Breakdown Field Strength of Syntactic Foam

Strauchs, Anja; Schnettler, Armin

Piscataway, NJ : IEEE [u.a.] (2012)
Contribution to a book, Contribution to a conference proceedings

In: 2012 annual report / Conference on Electrical Insulation and Dielectric Phenomena (CEIDP 2012) : Montreal, Quebec, Canada, 14 - 17 October 2012 / [sponsored by the Dielectrics and Electrical Insulation Society (DEIS) of the IEEE]
Page(s)/Article-Nr.: 331-334